Modules & Dev Boards
BH1750FVI Module
Sourcing BH1750FVI Module? This modules & dev boards component is supplied through authorized channels with datasheet-verified specs. The headline rating is Packaging of Cut tape. It is commonly specified for wireless connectivity and gateways.
Overview
BH1750FVI Module is offered for builds that require Modules & Dev Boards parts rated to -20 C to +70 C, with authorized-channel sourcing and documentation.
Sourcing and lead time
Stocked quantities ship from inventory; larger volumes are scheduled through authorized distribution. Request a quote with your annual usage for firm pricing.
Selection notes
Specify BH1750FVI Module by fixing the headline parameter first, then qualifying package, mounting, and compliance (RoHS, CE, FCC) against your board and end-market.
Typical application
This part is most often used in wireless connectivity and gateways. Share your circuit conditions and we can confirm derating headroom before you commit to a build.
| Packaging | Cut tape |
|---|---|
| Mounting | Panel mount |
| Operating range | -20 C to +70 C |
| Compliance | RoHS, CE, FCC |
Figures reflect typical catalog values; confirm against the manufacturer datasheet for your lot.