Discrete Semiconductors
Igbt Module BSM50GB 75GB 100GB 150GB 200GB 300GB170DLC
Igbt Module BSM50GB 75GB 100GB 150GB 200GB 300GB170DLC is a Discrete Semiconductors part stocked for production builds. The headline rating is Density of 75GB. It is commonly specified for wireless connectivity and gateways.
Overview
Igbt Module BSM50GB 75GB 100GB 150GB 200GB 300GB170DLC is offered for builds that require Discrete Semiconductors parts rated to -65 C to +175 C, with authorized-channel sourcing and documentation.
Sourcing and lead time
Stocked quantities ship from inventory; larger volumes are scheduled through authorized distribution. Request a quote with your annual usage for firm pricing.
Typical application
This part is most often used in wireless connectivity and gateways. Share your circuit conditions and we can confirm derating headroom before you commit to a build.
Selection notes
Specify Igbt Module BSM50GB 75GB 100GB 150GB 200GB 300GB170DLC by fixing the headline parameter first, then qualifying package, mounting, and compliance (RoHS, AEC-Q101) against your board and end-market.
| Density | 75GB |
|---|---|
| Lead finish | Matte tin (Sn) |
| Termination | Press-fit |
| Operating range | -65 C to +175 C |
| Compliance | RoHS, AEC-Q101 |
Figures reflect typical catalog values; confirm against the manufacturer datasheet for your lot.