Passive Components
XC7Z007S 1CLG400I System On Chip Soc Lfbga 400 1

We supply XC7Z007S 1CLG400I System On Chip Soc Lfbga 400 1 for OEM and contract-manufacturing customers. The headline rating is Package of 400. Lead time and volume pricing are available on request. It is commonly specified for pull-up, pull-down, and biasing networks.
Overview
XC7Z007S 1CLG400I System On Chip Soc Lfbga 400 1 is selected when the design needs a Passive Components part with predictable, traceable performance. Each lot ships with date codes and, on request, a certificate of conformance.
Typical application
In the field, XC7Z007S 1CLG400I System On Chip Soc Lfbga 400 1 is specified for pull-up, pull-down, and biasing networks; we can suggest equivalents within the same family if a cost-down or second source is needed.
Selection notes
For XC7Z007S 1CLG400I System On Chip Soc Lfbga 400 1, the dominant trade-offs are rating margin, footprint, and cost at volume; we can map those against equivalents on request.
Sourcing and lead time
We hold buffer stock on this reference and place factory orders for high volumes. Standard reel and tray multiples apply for production quantities.
| Package | 400 |
|---|---|
| Termination | Press-fit |
| Lead finish | Matte tin (Sn) |
| Operating range | -55 C to +155 C |
| Compliance | RoHS, AEC-Q200 |
Figures reflect typical catalog values; confirm against the manufacturer datasheet for your lot.